Description
Laser Dielectric Ablation is an application of advanced metallization schemes in order to reduce shadow losses and series resistance losses and to improve the contact to the emitter.
Product Features
CCD vision system for automatic alignment；
Air extraction and filtering equipment.
Auto loading & unloading system.
High reliability resulting in high uptime.
Stack or Cassette for option
Designed for 24 hours, 7 days operation.
Ease of operation.
Specifications
|
Product Type |
PE-W700-B |
|
Wafer Size(mm) |
156.5x156.5(6”) ,125x125(5”) |
|
Wafer Thickness(μm) |
150-220 |
|
Spot Size |
45-60um |
|
Breakage Rate |
< 0.2% |
Sample Show
Packaging & Delivery
1. Prompt deliver at the very day.
2. Sophisticated and professional logistic agent.
3. Well-trained and disciplined packing team.
4. After-sale service:Any questions or problems after receiving the product, please feel free to contact us.
Problems would be solved for you immediately.
Competitive Advantages
1. We offer high quality products at competitive price in quick delivery.
2. 100% custom pass guaranteed.
3. Good after-sale service.
4. Flexible and Untraceable payment terms.
5. Our products have been exported to Germany, Norway, Poland, Finland, Spain, UK, France, Russia, USA, Brazil, Mexico, Australia, Japan, Korea, Thailand, Indonesia, Uruguay and many other countries.
Laser Dielectric Ablation Inline System for Module Isolation and Hermetic Sealing.pdf
