Payment & Shipping Terms:
|Application:||Laser Scribing||Laser Type:||Fiber Laser|
|Applicable Material:||Monocrystalline Silicon And Polycrystalline Silicon||Control Software:||Laser Scriber|
|Place Of Origin:||Hubei, China (Mainland)||Laser Power:||20W / 10W|
solar cell laser cutting machine,
laser scribe machine
PEDB-10HD /20HD type automatic laser scribing equipment is suitable for monocrystalline silicon and polycrystalline silicon solar cell scribing processing, equally average transverse cutting different specifications cell.
Devices have automatic operation function, including automatic material feeding, automatic identification, automatic scribing, automatic splitting, automatic sorting, automatic discharging, dust filter dust removal.
1.New design: Reconstruct the mechanical structure to make the device structure more compact, easier to use. Rewrite the part of the fiber laser scribing machine software source code to make software run more stable and faster.
2.High Configuration: Using 20W fiber laser, make the beam quality better (standard base model), kerf finer (30μm), and more smooth edge.
3.Free-maintenance: machine using standard modular design, the real free-maintenance uninterrupted continuous operation, without wasting replacement of wearing parts.
4.Easy operation: an integrated air-cooled device settings, device smaller, more simple operation.
5.Dedicated control software: specifically for laser scribing machine designed control software, easy to operate, can be displayed in real time dicing path.
6.High efficiency: T-station duplex alternating operation, improve work efficiency dicing maximum speed up to 200mm / s
7.The machine is fully enclosed except two connecting ports for loading and unloading.
8. Front port adopted high-tech automatic feeding mechanism.
9. Automatic positioning mechanism
10. Automatic adsorption and extraction dust removal system
11. High-speed motion scribing laser head
12. Automatic breaking mechanism
13. Automatic detection and automatic identification system
Able to adapt to silicon, polycrystalline silicon, amorphous silicon cells and dicing of silicon, germanium, gallium arsenide semiconductor material scribing and cutting.
1. Prompt deliver at the very day.
2. Well-trained and disciplined packing team.
3. After-sale service:. Any questions or problems after receiving the product, please feel free to contact us. Problems would be solved for you immediately.
4. Sophisticated and professional logistic agent.
1. 100% custom pass guaranteed.
2. Our products have been exported to Germany, Norway, Poland, Finland, Spain, UK, France, Russia, USA, Brazil, Mexico, Australia, Japan, Korea, Thailand, Indonesia, Uruguay and many other countries.
3. Flexible and Untraceable payment terms.
4. Good after-sale service.
5. We offer high quality products at competitive price in quick delivery.
|Pre-Sales Service||After-Sales Service|
* Inquiry and consulting support.
* Sample testing support.
* View our Factory.
* Training how to instal the machine, training how to use the machine.
* Engineers available to service machinery overseas.
Contact Person: Helen